ILD 6-6 marks the culmination of the inter-layer dielectric 6 module, functioning as the Wafer Bonding Layer (WBL) required for the subsequent Direct Bond Interconnect (DBI) integration A2.Following the deposition of the preceding ILD 6 stacks, this layer completes the top dielectric matrix to encapsulate the underlying metal lines and provide a pristine surface essential for wafer-to-wafer hybrid bonding A2.Because the subsequent steps involve creating METAL 8 (DBI Pad) trenches via lithography