The ILD 6-1 Etch is the concluding dry etch step in the multi-stage dielectric patterning sequence for the Direct Bond Interconnect (DBI) module A2. Proceeding through ILD 6-4 to 6-2, the structure's upper trench and via geometries are defined, while this final step typically completes the via opening and breaks through the bottom etch-stop layer to expose the underlying metal pad or contact A2. Precise pattern transfer at this stage is critical because the subsequent steps involve ashing, clean