The ILD 6-6 (Wafer Bonding Layer, WBL) Etch is a critical front-end step for establishing the structural foundation of Direct Bond Interconnects (DBI) in heterogeneous integration P1.Following the deposition of the WBL and subsequent trench lithography, this dry etching process transfers the Metal 8 DBI pad patterns into the topmost dielectric layer A1.This defines the dielectric field regions that will eventually surround the top-level Cu pads P1.Creating precise trenches is imperative because