The "Bond Pad Cavity - Photo" step defines the precise geometric boundaries of the packaging recess within the top dielectric stack A1.Placed after the deposition of the ILD 6-1 (SiCN) and ILD 6-2 (Oxide) layers, this lithographic process provides the mask for the subsequent sequential etches through the oxide and SiCN films T1.Unlike standard bond pad opening steps that simply clear passivation from existing top metal surfaces, a cavity photo step specifically defines a structurally recessed tr