The Metal 7 Aluminum (Al) deposition step functions as the uppermost metallization layer, specifically creating the bond pad structures necessary for packaging and external signal routing A1.Unlike the Metal 0 and Metal 1 layers, which typically utilize tungsten (W) or copper (Cu) in damascene processes to achieve fine-pitch interconnects and low RC delays P1, Metal 7 is optimized for macroscopic signal transfer and environmental stability rather than maximum routing density (Engineering Practic