The Metal 7 Bond Pad - Photo step is a critical lithographic process that defines the spatial geometry of the top-level metallization used for semiconductor packaging T1.In the integration flow, this step immediately follows the blanket deposition of the Al-Cu metal layer and a Ta-based liner, serving to create the protective polymeric mask required for the subsequent Ta-barrier and Al metal plasma etches P2.Unlike the Metal 0, 1, and 2 photo steps—which utilize high-resolution techniques to pat