After the Optical Pad 2 Etch, the wafer surface is covered with degraded photoresist and tough fluorocarbon-based post-etch residues P3.This Ashing & Strip/Clean step aims to completely eradicate these organic and organometallic byproducts before the subsequent Mid Vertical Grid Deposition A2.If left untreated, these residues can compromise the structural adhesion and electrical integrity of the grid materials P1.What distinguishes this specific step from other ashing steps in the flow is its lo