Following the LS/Aperture Grid Barrier Deposition, the LS/Aperture Grid Deposition step creates the primary opaque metallic layer on the backside of the thinned BSI CMOS image sensor P1.In modern sub-micron pixel architectures, backside illumination (BSI) greatly enhances the fill factor by moving the wiring to the front side A1.However, densely packed pixels are highly susceptible to optical crosstalk, where obliquely incident photons penetrate adjacent pixels, degrading color fidelity and spat