In a 40nm Back-Side Illuminated (BSI) CMOS Image Sensor, this step is engineered to form a temporary topographical template that will eventually define the curvature of the lower on-chip lens (LOCL) (Engineering Practice).Positioned immediately after the Lower OCL Planar Layer Deposition and Pre Litho Cleaning, this process coats, exposes, and develops a photosensitive organic polymer into discrete geometric blocks (typically cylinders) P1.These structures prepare the wafer for the subsequent Sa