The CIS/ISP Wafer TC (Thermocompression) Bond step physically executes the structural and electrical integration of the image sensor and the signal processor, transitioning from the purely positional alignment achieved in the preceding step to a permanent physical union A2. While the prior alignment step ensures the micrometer-scale registration of interconnect pads, the TC bond step applies the necessary thermo-mechanical driving forces to initiate atomic interaction across the interface P2. By