The post-bond anneal step serves as the critical mechanical and electrical stabilization phase following the initial room-temperature thermocompression bonding of the CMOS Image Sensor (CIS) and Image Signal Processor (ISP) wafers A3.During initial contact, the hybrid wafer interface relies primarily on weak van der Waals forces and hydrogen bonding P4.Because the subsequent process flow requires aggressive mechanical bulk silicon removal, such as backside surface grinding, the bonding interface