Following RF surface activation, the CIS and ISP wafers possess high-density dangling bonds and elevated surface energy states P3.Before these highly reactive surfaces can be brought into physical contact, they must be precisely aligned in the CIS/ISP Wafer Bond Align step A2.Unlike the preceding wafer bond pairing step, which merely handles the logistical assignment of a specific CIS wafer to a corresponding ISP wafer, this alignment step dictates the exact spatial registration (x, y, and angul