The previous steps in the flow completed the Metal 0 patterning, etching, and cleaning (Engineering Practice).The PMD 4 - Deposition step serves to encapsulate these underlying local interconnects and provides a robust structural dielectric base for the subsequent Pre Litho Cleaning and Metal 1/Contact Opening steps A1.Tungsten-based middle-of-the-line (MOL) local interconnects are highly sensitive to downstream process contamination, making a high-quality dielectric encapsulation critical to ma