40nm Process FlowCIS
40nm CMOS Image Sensor process flow. From pixel array to microlens, learn CIS manufacturing and optoelectronic integration.
40nm BSI CMOS Image Sensor
417 stepsStep index
- Wafer Start · Wafer In
- Wafer Start · WF Laser markings
- Wafer Start · Particle Removal
- Wafer Start · Oxidation Pre-Cleaning
- Wafer Start · Oxide growth
- Wafer Start · Nitride deposition
- Wafer Start · Pre Litho Cleaning
- Wafer Start · Align Marker Pattern - Photo
- Wafer Start · Nitride Etch
- Wafer Start · Oxide Etch
- Wafer Start · Ashing & Strip/Clean
- Frontside DTI · SiO Hard Mask deposition
- Frontside DTI · Pre Litho Cleaning
- Frontside DTI · Frontside Deep Trench - Photo
- Frontside DTI · Oxide Hard Mask Etch
- Frontside DTI · Silicon Full Trench Etch (Anisotropic)
- Frontside DTI · Ashing & Strip/Clean
- Frontside DTI · Trench Vacuum dry
- Frontside DTI · SiN Fill
- Frontside DTI · CMP Removal of Excees Nitride
- Frontside DTI · Post CMP Cleaning
- Frontside DTI · Wet Etch Removal of Excess Nitride
- Frontside DTI · Oxide Hard Mask Removal
- Frontside DTI · Pre-Cleaning
- STI · SiN Hard Mask Deposition
- STI · SiO Hard Mask Deposition
- STI · Pre Litho Cleaning
- STI · Shallow Trench Isolation - Photo
- STI · Oxide Etch
- STI · Nitride Etch
- STI · Si Etch
- STI · Ashing & Strip/Clean
- STI · Trench Sidewall Passivation
- STI · STI Liner Oxidation
- STI · STI Fill Conformal CVD Liner
- STI · STI Fill Liner Etchback
- STI · Oxidation Preaclean
- STI · STI Fill Conformal CVD Oxide
- STI · STI Fill Post Clean
- STI · STI Conformal CVD Anneal
- STI · Pre-CMP Oxide Deposition
- STI · STI CMP
- STI · STI CMP Post Cleaning
- STI · STI Final Densification Anneal
- STI · Wet Deglaze Etch
- STI · SiN Strip
- STI · Blanket B Well Implant
- Well · Ox growth
- Well · Pre Litho Cleaning
- Well · Periphery N-Well Implant Mask Lithography
- Well · N-Well Ion Implantation
- Well · Ashing & Strip/Clean
- Photodiode · Photocathode Implant Mask Lithography
- Photodiode · N Photocathode Ion Implantation
- Photodiode · Ashing & Strip/Clean
- Well · Pixel Array P-Well Implant Mask Lithography
- Well · P-Well Ion Implantation
- Well · Ashing & Strip/Clean
- Well · Periphery P-Well Implant Mask Lithography
- Well · P-Well Ion Implantation
- Well · Ashing & Strip/Clean
- Well · Periphery N-Well Contact Implant Mask Lithography
- Well · N-Well Contact Ion Implantation
- Well · Ashing & Strip/Clean
- NMOS · NMOS VT Adjust Implant Mask Lithography
- NMOS · NMOS VT Adjust Ion Implantation
- NMOS · Ashing & Strip/Clean
- NMOS · Implant Oxide Removal
- Dual Gate Oxide · Sacrificial Oxidation
- Dual Gate Oxide · SACOX Removal
- Dual Gate Oxide · Thin Gate Oxide Growth
- Dual Gate Oxide · Nitride Hard Mask Deposition
- Dual Gate Oxide · Pre Litho Cleaning
- Dual Gate Oxide · Thick Gate Oxide - Photo
- Dual Gate Oxide · Nitride Hard Mask Etch
- Dual Gate Oxide · Ashing & Strip/Clean
- Dual Gate Oxide · Thick Gate Oxide Growth
- Dual Gate Oxide · Nitride Hard Mask Removal
- Gate · As-doped PolySi deposition
- Gate · PolySi Anneal
- Gate · Pre Litho Cleaning
- Gate · Gate Formation - Photo
- Gate · PolySi - Etch
- Gate · Ashing & Strip/Clean
- NMOS · NMOS LDD Implant Mask Lithography
- NMOS · NMOS LDD Ion Implantation
- NMOS · Ashing & Strip/Clean
- Sidewall Spacer · SWS (Pad Oxide) Deposition
- Sidewall Spacer · SWS Nitride Deposition
- Sidewall Spacer · SWS Nitride Anisotropic Back Etch
- Sidewall Spacer · Ashing & Strip/Clean
- N+ S/D + Floating Diffusion · NMOS S/D, FD Implant Mask Lithography
- N+ S/D + Floating Diffusion · NMOS S/D, FD Ion Implantation
- N+ S/D + Floating Diffusion · Ashing & Strip/Clean
- N Floating Diffusion · N FD Implant Mask Lithography
- N Floating Diffusion · N FD (Between T1 and T2) Ion Implantation
- N Floating Diffusion · Ashing & Strip/Clean
- Photodiode · P-Pinning Implant Mask Lithography
- Photodiode · P-Pinning Ion Implantation
- Photodiode · Ashing & Strip/Clean
- P+ Contact · P+ VSS and Periphery P-Well Contact Implant Mask Lithography
- P+ Contact · VSS and Periphery P-Well Contact Ion Implantation
- P+ Contact · Ashing & Strip/Clean
- P+ Contact · Dopants Activation
- PMD · CESL 1 - Deposition
- PMD · CESL 2 - Deposition
- PMD · PMD 1 - Deposition
- PMD · PMD 2 - Deposition
- PMD · PMD 3 - Deposition
- PMD · PMD 3 CMP
- PMD · Post CMP Cleaning
- Contact · Metal 0 Gate and S/D Contact Opening - Photo
- Contact · PMD 3 Etch
- Contact · PMD 2 Etch
- Contact · PMD 1 Etch
- Contact · CESL 2 - Etch
- Contact · CESL 1 - Etch
- Contact · Pad Oxide Etch
- Contact · Poly/Si Back Etch
- Contact · Ashing & Strip/Clean
- Contact · Ti/TiN Deposition
- Contact · W Deposition
- Contact · W CMP
- Contact · TiN/Ti CMP
- Metal 0 · Post CMP Cleaning
- Metal 0 · Metal 0 W Deposition
- Metal 0 · Pre Litho Cleaning
- Metal 0 · Metal 0 - Photo
- Metal 0 · W Etch
- Metal 0 · Ashing & Strip/Clean
- PMD · PMD 4 - Deposition
- PMD · Pre Litho Cleaning
- Contact · Metal 1 Gate, S/D Contact Opening - Photo
- Contact · PMD 4 Etch
- Contact · PMD 3 Etch
- Contact · PMD 2 Etch
- Contact · PMD 1 Etch
- Contact · CESL 2 - Etch
- Contact · CESL 1 - Etch
- Contact · Pad Oxide Etch
- Contact · Ashing & Strip/Clean
- Contact · Ti Deposition
- Contact · TiN Deposition
- Contact · W Deposition
- Contact · W CMP
- Contact · TiN/Ti CMP
- Contact · Post CMP Cleaning
- Contact · Low Temperature Anneal
- PMD · PMD 5 - Deposition
- PMD · Pre Litho Cleaning
- Metal 1 · METAL 1 TRENCH - Photo
- Metal 1 · PMD 5 Oxide Etch
- Metal 1 · PMD 4 Oxide Etch
- Metal 1 · Ashing & Strip/Clean
- Metal 1 · Ta-based liner deposition
- Metal 1 · Cu Seed deposition
- Metal 1 · Metal 1 Cu deposition
- Metal 1 · Cu CMP
- Metal 1 · Ta-based liner CMP
- Metal 1 · Post CMP Cleaning
- Interlayer Dielectric 1 · ILD 1-1 SiCN Barrier Deposition
- Interlayer Dielectric 1 · ILD 1-2 SiO2 Gap-Fill Deposition
- Interlayer Dielectric 1 · Pre Litho Cleaning
- Via 1 · VIA 1 - Photo
- Via 1 · ILD 1-2 Oxide Etch
- Via 1 · ILD 1-1 SiCN Etch
- Via 1 · Ashing & Strip/Clean
- Metal 2 · METAL 2 TRENCH - Photo
- Metal 2 · ILD 1-2 Oxide Etch
- Metal 2 · Ashing & Strip/Clean
- Metal 2 · Ta-based liner deposition
- Metal 2 · Cu Seed deposition
- Metal 2 · Metal 2 Cu deposition
- Metal 2 · Cu CMP
- Metal 2 · Ta-based liner CMP
- Metal 2 · Post CMP Cleaning
- Interlayer Dielectric 2 · ILD 2-1 Deposition
- Interlayer Dielectric 2 · ILD 2-2 Deposition
- Interlayer Dielectric 2 · Pre Litho Cleaning
- Via 2 · VIA 2 - Photo
- Via 2 · ILD 2-2 Oxide Etch
- Via 2 · ILD 2-1 SiCN Etch
- Via 2 · Ashing & Strip/Clean
- Metal 3 · METAL 3 TRENCH - Photo
- Metal 3 · ILD 2-2 Oxide Etch
- Metal 3 · Ashing & Strip/Clean
- Metal 3 · Ta-based liner deposition
- Metal 3 · Cu Seed deposition
- Metal 3 · Metal 3 Cu deposition
- Metal 3 · Cu CMP
- Metal 3 · Ta-based liner CMP
- Metal 3 · Post CMP Cleaning
- Interlayer Dielectric 3 · ILD 3-1 Deposition
- Interlayer Dielectric 3 · ILD 3-2 Deposition
- Interlayer Dielectric 3 · Pre Litho Cleaning
- Via 3 · VIA 3 - Photo
- Via 3 · ILD 3-2 Oxide Etch
- Via 3 · ILD 3-1 SiCN Etch
- Via 3 · Ashing & Strip/Clean
- Metal 4 · METAL 4 TRENCH - Photo
- Metal 4 · ILD 3-2 Oxide Etch
- Metal 4 · Ashing & Strip/Clean
- Metal 4 · Ta-based liner deposition
- Metal 4 · Cu Seed deposition
- Metal 4 · Metal 4 Cu deposition
- Metal 4 · Cu CMP
- Metal 4 · Ta-based liner CMP
- Metal 4 · Post CMP Cleaning
- Interlayer Dielectric 4 · ILD 4-1 Deposition
- Interlayer Dielectric 4 · ILD 4-2 Deposition
- Interlayer Dielectric 4 · Pre Litho Cleaning
- Via 4 · VIA 4 - Photo
- Via 4 · ILD 4-2 Oxide Etch
- Via 4 · ILD 4-1 SiCN Etch
- Via 4 · Ashing & Strip/Clean
- Metal 5 · METAL 5 TRENCH - Photo
- Metal 5 · ILD 4-2 Oxide Etch
- Metal 5 · Ashing & Strip/Clean
- Metal 5 · Ta-based liner deposition
- Metal 5 · Cu Seed deposition
- Metal 5 · Metal 4 Cu deposition
- Metal 5 · Cu CMP
- Metal 5 · Ta-based liner CMP
- Metal 5 · Post CMP Cleaning
- Interlayer Dielectric 5 · ILD 5-1 Deposition
- Interlayer Dielectric 5 · ILD 5-2 Deposition
- Interlayer Dielectric 5 · Pre Litho Cleaning
- Via 5 · VIA 5 - Photo
- Via 5 · ILD 5-2 Oxide Etch
- Via 5 · ILD 5-1 SiCN Etch
- Via 5 · Ashing & Strip/Clean
- Metal 6 · METAL 6 TRENCH - Photo
- Metal 6 · ILD 5-2 Oxide Etch
- Metal 6 · Ashing
- Via 5 · Strip & Cleaning
- Metal 6 · Ta-based liner deposition
- Metal 6 · Cu Seed deposition
- Metal 6 · Metal 5 Cu deposition
- Metal 6 · Cu CMP
- Metal 6 · Ta-based liner CMP
- Metal 6 · Post CMP Cleaning
- Interlayer Dielectric 6 · ILD 6-1 Deposition
- Interlayer Dielectric 6 · ILD 6-2 Deposition
- Interlayer Dielectric 6 · Pre Litho Cleaning
- Bond Pad · Bond Pad Cavity - Photo
- Bond Pad · ILD 6-2 Oxide Etch
- Bond Pad · ILD 6-1 SiCN Etch
- Bond Pad · ILD 5-2 Oxide Etch
- Bond Pad · ILD 5-1 SiCN Etch
- Bond Pad · ILD 4-2 Oxide Etch
- Bond Pad · ILD 4-1 SiCN Etch
- Bond Pad · ILD 3-2 Oxide Etch
- Bond Pad · Ashing & Strip/Clean
- Bond Pad · Ta-based Bottom Barrier deposition
- Bond Pad · Metal 7 Al Metal Deposition
- Bond Pad · Ta-based liner deposition
- Bond Pad · Pre Litho Cleaning
- Bond Pad · Metal 7 Bond Pad - Photo
- Bond Pad · Ta-Barrier etch
- Bond Pad · Al Metal Etch
- Bond Pad · Ta-Barrier etch
- Bond Pad · Ashing & Strip/Clean
- Interlayer Dielectric 6 · ILD 6-3 Deposition
- Interlayer Dielectric 6 · ILD 6-4 Deposition
- Interlayer Dielectric 6 · ILD 6-5 Deposition
- Interlayer Dielectric 6 · ILD 6-6 (WBL) Deposition
- Interlayer Dielectric 6 · Pre Litho Cleaning
- Direct Bond Interconnect · METAL 8 (DBI Pad) TRENCH - Photo
- Direct Bond Interconnect · ILD 6-6 (WBL) Etch
- Direct Bond Interconnect · ILD 6-5 Etch
- Direct Bond Interconnect · Ashing & Strip/Clean
- Direct Bond Interconnect · VIA 7 (DBI Via) - Photo
- Direct Bond Interconnect · ILD 6-5 Etch
- Direct Bond Interconnect · ILD 6-4 Etch
- Direct Bond Interconnect · ILD 6-3 Etch
- Direct Bond Interconnect · ILD 6-2 Etch
- Direct Bond Interconnect · ILD 6-1 Etch
- Direct Bond Interconnect · Ashing & Strip/Clean
- Direct Bond Interconnect · Ta-based liner deposition
- Direct Bond Interconnect · Cu Seed deposition
- Direct Bond Interconnect · Metal 6 Cu deposition
- Direct Bond Interconnect · Cu CMP
- Direct Bond Interconnect · Ta-based liner CMP
- Direct Bond Interconnect · Final Oxide CMP
- Direct Bond Interconnect · Post CMP Cleaning
- Wafer Bonding · CIS/ISP wafer bond pairing
- Wafer Bonding · RF surface activation CIS
- Wafer Bonding · RF surface activation ISP
- Wafer Bonding · CIS/ISP Wafer Bond Align
- Wafer Bonding · CIS/ISP Wafer TC Bond
- Wafer Bonding · Post-Bond Anneal
- Wafer Thinning · CIS Backside Wafer Surface Grind
- Wafer Thinning · CIS Backside Wafer Edge-Grind
- Wafer Thinning · ultrasonic clean
- Wafer Thinning · CIS Backside Si, CMP1
- Wafer Thinning · CIS Backside Si, CMP2 (target thickness adjust)
- Wafer Thinning · ultrasonic cleaning
- Backside Passivation · Oxide hard mask deposition
- Backside Passivation · Pre Litho Cleaning
- Backside Passivation · Backside Passivation Implant Mask Lithography
- Backside Passivation · Back Passivation Ion Implantation
- Backside Passivation · Ashing & Strip/Clean
- Backside Passivation · Oxide hard mask etch
- Backside Passivation · Vacuum Bake
- Backside Passivation · Rapid Thermal Processing
- Backside Passivation · RF Plasma
- Backside Passivation · HKD/AR1 AlO deposition
- Backside Passivation · HKD/AR2 TaO deposition
- Backside Passivation · BPMD SiO Deposition
- Substrate Contact · Pre Litho Cleaning
- Substrate Contact · Backside Substrate Contact - Photo
- Substrate Contact · BPMD Etch
- Substrate Contact · HKD/AR2 Etch
- Substrate Contact · HKD/AR1 Etch
- Substrate Contact · RIE etch, Si Back etch
- Substrate Contact · LS Backside Contact Ion Implantation
- Substrate Contact · Ashing & Strip/Clean
- Light Shield Grid · LS/Aperture Grid Barrier Deposition
- Light Shield Grid · LS/Aperture Grid Deposition
- Light Shield Grid · Oxide Grid Seal Layer Deposition
- Light Shield Grid · Pre Litho Cleaning
- Light Shield Grid · Light Shield/Aperture Grid - Photo
- Light Shield Grid · Oxide Grid Seal Layer Etch
- Light Shield Grid · W Etch
- Light Shield Grid · TiN Etch
- Light Shield Grid · Ashing & Strip/Clean
- Light Shield Grid · Optical Pad 1 Deposition
- Light Shield Grid · Pre Litho Cleaning
- Light Shield Grid · Lower Vertical Grid Trench - Photo
- Light Shield Grid · Optical Pad 1 Etch
- Light Shield Grid · Oxide Grid Seal Layer Etch
- Light Shield Grid · Ashing & Strip/Clean
- Light Shield Grid · Lower Vertical Grid Barrier Deposition
- Light Shield Grid · Lower Vertical Grid Deposition
- Light Shield Grid · W CMP
- Light Shield Grid · Post CMP Cleaning
- Light Shield Grid · Optical Pad 2 Deposition
- Light Shield Grid · Lower OCL Planar Layer Deposition
- Lower Over-Coat · Pre Litho Cleaning
- Lower Over-Coat · Sacrificial Lower OCL - Coat/Expose/Develop/bake
- Lower Over-Coat · Sacrificial Lower OCL Reflow
- Lower Over-Coat · Final UV/Hard bake
- Lower Over-Coat · Sacrificial Lower OCL Etch
- Lower Over-Coat · Ashing
- Lower Over-Coat · Lower OCL Coating Deposition
- Light Shield Grid · Optical Pad 3 Deposition
- Light Shield Grid · Optical Pad 3 CMP
- Light Shield Grid · Post CMP Cleaning
- Light Shield Grid · Pre Litho Cleaning
- Light Shield Grid · Mid Vertical Grid Trench - Photo
- Light Shield Grid · Optical Pad 3 Etch
- Light Shield Grid · Lower OCL Coating Etch
- Light Shield Grid · Lower OCL Etch
- Light Shield Grid · Optical Pad 2 Etch
- Light Shield Grid · Ashing & Strip/Clean
- Light Shield Grid · Mid Vertical Grid Deposition
- Light Shield Grid · W CMP
- Light Shield Grid · Post CMP Cleaning
- Light Shield Grid · Upper Vertical Grid Barrier Deposition
- Light Shield Grid · Upper Vertical Grid Deposition
- Light Shield Grid · Pre Litho Cleaning
- Light Shield Grid · Upper Vertical Grid - Photo
- Light Shield Grid · W Etch
- Light Shield Grid · TiN Etch
- Light Shield Grid · Ashing & Strip/Clean
- Light Shield Grid · Upper Grid Seal Layer Deposition
- Light Shield Grid · Pre Litho Cleaning
- Color Filter Array · Color Filter - Green, Coat/Expose/Develop/Bake
- Color Filter Array · Final Hard Bake
- Color Filter Array · Color Filter - Blue, Coat/Expose/Develop/Bake
- Color Filter Array · Final Hard Bake
- Color Filter Array · Color Filter - Red, Coat/Expose/Develop/Bake
- Color Filter Array · Final Hard Bake
- Color Filter Array · Color Filter - Cyan, Coat/Expose/Develop/Bake
- Color Filter Array · Final Hard Bake
- Microlens · Upper OCL planarization (base) layer Coat/Bake
- Microlens · Upper OCL - Coat/Expose/Develop/bake
- Microlens · Upper OCL Reflow
- Microlens · Final UV/Hard Bake
- Microlens · Upper OCL Coating (protective oxide)
- Microlens · Pre Litho Cleaning
- Bond Pad · Bond Pad Opening 1 - Photo
- Bond Pad · Upper OCL Coating Etch
- Bond Pad · Ashing & Strip/Clean
- Bond Pad · Bond Pad Opening 2 - Photo
- Bond Pad · Upper Grid Seal Layer Etch
- Bond Pad · Optical Pad 3 Etch
- Bond Pad · Lower OCL Coating Etch
- Bond Pad · Lower OCL Etch
- Bond Pad · Optical Pad 2 Etch
- Bond Pad · Optical Pad 1 Etch
- Bond Pad · Oxide Grid Seal Layer Etch
- Bond Pad · BPMD Etch
- Bond Pad · HKD/AR2 Etch
- Bond Pad · HKD/AR1 Etch
- Bond Pad · RIE etch, Si Back etch
- Bond Pad · Ashing & Strip/Clean
- Bond Pad · Bond Pad Opening 3 - Photo
- Bond Pad · Si Etch
- Bond Pad · Pad Oxide Etch
- Bond Pad · CESL 1 Etch
- Bond Pad · CESL 2 Etch
- Bond Pad · PMD 1 Etch
- Bond Pad · PMD 2 Etch
- Bond Pad · PMD 3 Etch
- Bond Pad · PMD 4 Etch
- Bond Pad · PMD 5 Etch
- Bond Pad · RIE etch ILD 1-1 Etch
- Bond Pad · RIE etch ILD 1-2 Etch
- Bond Pad · RIE etch ILD 2-1 Etch
- Bond Pad · RIE etch ILD 2-2 Etch
- Bond Pad · RIE etch ILD 3-1 Etch
- Bond Pad · RIE etch ILD 3-2 Etch
- Bond Pad · Bond Pad Metal 7 Barrier Etch
- Bond Pad · Ashing & Strip/Clean
- Wafer Start · Final Inspection
- Wafer Start · FABOUT