The Final UV/Hard bake step is positioned immediately after the Sacrificial Lower Organic Cleared Layer (OCL) Reflow and prior to the Sacrificial Lower OCL Etch P4.While earlier hard bake steps in the process flow primarily serve to drive off solvents and improve basic adhesion, this specific step utilizes both ultraviolet (UV) radiation and thermal energy to permanently lock in the reshaped polymer profile T1.The preceding reflow process leverages thermal energy to allow the polymer to flow and