The fabrication of complementary metal oxide semiconductor (CMOS) image sensors relies on the sequential lithographic patterning of dye-doped polymer color filters P3.In this specific integration flow, the Final Hard Bake step immediately follows the coating, exposure, development, and initial bake of the Green Color Filter Array (CFA) (Engineering Practice).Because the color filters are formed sequentially—typically Green, followed by Blue, and then Red—the Green polymer matrix must be complete