In Backside Illuminated (BSI) CMOS image sensors, the Bayer color filter array is formed by sequentially patterning different color resists to match the underlying photodiode grids A2.Standard image sensor manufacturing utilizes dye-doped polymer color filters that require a multi-stage, sequential fabrication process P1.Following the coating, exposure, and development of the Red color filter, this specific "Final Hard Bake" is executed to fully stabilize the newly patterned red resin (Engineeri