Consequently, the plasma chemistry must be tuned to an optimized carbon-to-fluorine ratio; excessive fluorine leads to sidewall bowing and low-k damage, while excess carbon causes etch-stop phenomena due to over-polymerization [P1].
The ILD 1-2 Oxide Etch step is a critical back-end-of-line (BEOL) …
Sign in to continue through all 417 steps
Sign Up Free