Ashing & Strip/Clean (V2) - 40nm | SemiFlows

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Ashing & Strip/Clean

168METAL 2 TRENCH - Photo 169ILD 1-2 Oxide Etch 170Ashing & Strip/Clean 171Ta-based liner deposition 172Cu Seed deposition 173Metal 2 Cu deposition 174Cu CMP 175Ta-based liner CMP 176Post CMP Cleaning 177ILD 2-1 Deposition 178ILD 2-2 Deposition 179Pre Litho Cleaning 180VIA 2 - Photo 181ILD 2-2 Oxide Etch 182ILD 2-1 SiCN Etch 183Ashing & Strip/Clean

Process Cross-Section

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Step highlight

Ashing & Strip/Clean modifies fluoropolymer residues and removes remaining photoresist from the SiCN surface to enable subsequent deposition processes [P2].

In depth

The Ashing & Strip/Clean step in the Via 2 (V2) module is a critical post-etch operation directly following the ILD 2-1 SiCN breakthrough etch …

Related steps

VIA 2 - Photo
ILD 2-2 Oxide Etch
ILD 2-1 SiCN Etch