Following the fabrication and thermal curing of the Color Filter Arrays (CFA) and the subsequent deposition of a planarizing base layer, the Upper On-Chip Lens (UOCL) Coat/Expose/Develop/bake step is executed A2.The primary function of the Upper OCL is to gather and focus incident light directly into the underlying pinned photodiode, thereby maximizing the pixel's quantum efficiency and minimizing signal loss P2.Unlike the preceding CFA patterning steps, which utilize dye-doped polymers designed