Following the formation, reflow, and UV/hard baking of the organic Upper On-Chip Lenses (UOCL), the lenses require a robust encapsulation layer to survive subsequent packaging and bonding processes P2.This step deposits a thin, highly transparent protective silicon oxide coating directly over the curved microlens array to act as a physical and chemical barrier P1.Unlike the subsequent "Upper OCL Coating Etch" step, which is a subtractive process designed to selectively remove this oxide over the