METAL 5 TRENCH - Photo - 40nm | SemiFlows

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METAL 5 TRENCH - Photo

216METAL 5 TRENCH - Photo 217ILD 4-2 Oxide Etch 218Ashing & Strip/Clean 219Ta-based liner deposition 220Cu Seed deposition 221Metal 4 Cu deposition 222Cu CMP 223Ta-based liner CMP 224Post CMP Cleaning 225ILD 5-1 Deposition 226ILD 5-2 Deposition 227Pre Litho Cleaning 228VIA 5 - Photo 229ILD 5-2 Oxide Etch 230ILD 5-1 SiCN Etch 231Ashing & Strip/Clean

Process Cross-Section

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Step highlight

The METAL 5 TRENCH - Photo step defines the spatial geometry for the fifth-level copper interconnect trenches within a via-first dual-damascene integration scheme [P1].

In depth

The METAL 5 TRENCH - Photo step defines the spatial geometry for the fifth-level copper interconnect trenches within a via-first du…

Related steps

ILD 4-2 Oxide Etch
Ashing & Strip/Clean
Ta-based liner deposition
Cu Seed deposition
Metal 4 Cu deposition
Cu CMP