PMD 5 Etch - 40nm BSI CMOS Image Sensor 40nm

During the etch, polymerizing fluorocarbon species deposit a thin passivation layer on the feature sidewalls to prevent lateral etching [P3].

PMD 5 Etch is the final stage of a multi-step Pre-Metal Dielectric (PMD) etching sequence in the bondpad module [A2]. In nanoscale Backside Illuminated (BSI…

During the etch, polymerizing fluorocarbon species deposit a thin passivation layer on the feature sidewalls to prevent lateral etching [P3].

PMD 5 Etch is the final stage of a multi-step Pre-Metal Dielectric (PMD) etching sequence in the bondpad module [A2]. In nanoscale Backside Illuminated (BSI…

40nm BSI CMOS Image SensorFree after sign-in

Process Cross-Section

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In depth

40nm BSI CMOS Image SensorFree after sign-in

Process Cross-Section

Step highlight

In depth