The ILD 5-2 Oxide Etch step is a critical back-end-of-line (BEOL) module designed to pattern the trench for the Metal 6 (M6) interconnects P2.Following the METAL 6 TRENCH - Photo step, this process selectively removes the inter-layer dielectric (ILD) to form the horizontal routing cavities that will subsequently be lined with a Ta-based barrier and filled with copper P2.This step is fundamentally distinct from front-end-of-line oxide etches (such as step #10 or #29) which typically define shallo