Technical Blog
Deep dive into the physics and integration logic of semiconductor manufacturing
40nm BSI CMOS Image Sensor Metal-Five Interconnect Integration: Process Flow Principles and Integration Logic
Role in the Complete Flow In a 40nm backside illumination (BSI) complementary metal-oxide-semiconductor (CMOS) image sensor, the metal-five (MET5) interconnect
14nm FinFET Contact Trench Integration Process Flow: Physics, Mechanisms, and Module Dependencies
Role in the Complete Flow The 14nm contact trench integration module occupies a critical transitional position in the overall FinFET fabrication sequence, bridg
28nm Planar Contact Formation Process Flow: Integration Principles, Mechanisms, and Module Dependencies
Role in the Complete Flow In the 28nm Planar process flow, the contact formation module occupies a pivotal position: it bridges the front-end-of-line (FEOL) tra
7nm FinFET Contact-Via Integration Process Flow: Principles, Mechanisms, and Module Dependencies
Role in the Complete Flow The 7nm FinFET contact-via integration module occupies a pivotal position in the overall process sequence: it bridges the front-end-of
40nm BSI CMOS Image Sensor Via-One Integration: Process Flow Principles and Device Physics
Role in the Complete Flow In the 40nm BSI CMOS Image Sensor process flow, the via-one (V1) integration module serves as the first vertical interconnect bridge b
40nm BSI CMOS Image Sensor Metal-Three Interconnect Integration: Process Flow Principles and Device Physics
Role in the Complete Flow In the 40nm backside illumination (BSI) complementary metal-oxide-semiconductor (CMOS) image sensor fabrication sequence, the metal-th
7nm FinFET Metal-Two Interconnect Integration: Process Flow Principles and ESL Deposition Mechanics
Role in the Complete Flow The metal-two (M2) interconnect module in a 7nm FinFET process flow occupies a critical position in the back-end-of-line (BEOL) archit
14nm FinFET Metal-Two Interconnect Integration: Process Flow, Physics, and Module Dependencies
Role in the Complete Flow In a 14nm FinFET logic technology, the metal-two (M2) interconnect module occupies a pivotal position in the back-end-of-line (BEOL) s
40nm BSI CMOS Image Sensor Bond-Pad Integration: Process Flow Principles and Integration Logic
Role in the Complete Flow In a 40nm BSI CMOS Image Sensor, the bond-pad integration module sits at the top of the back-end-of-line (BEOL) interconnect stack and
40nm BSI CMOS Image Sensor Via-Four Integration Process Flow: Physical Mechanisms, Integration Logic, and Failure Propagation
Role in the Complete Flow The 40nm BSI CMOS Image Sensor via-four integration process flow occupies a critical position in the back-end-of-line (BEOL) interconn
40nm BSI CMOS Image Sensor Metal-Six Interconnect Integration: Process Flow Principles and Integration Logic
Role in the Complete Flow In a 40nm BSI CMOS Image Sensor process flow, the metal-six (MET6) interconnect module serves as one of the uppermost wiring tiers, br
40nm BSI CMOS Image Sensor Sensor and Logic Wafer Bonding Process Flow: Integration Principles and Physical Mechanisms
Role in the Complete Flow In the 40nm BSI CMOS Image Sensor architecture, the sensor and logic wafer bonding module — often referred to as the BOND module — ser