Technical Blog
Deep dive into the physics and integration logic of semiconductor manufacturing
7nm FinFET Mid-Level Interconnect Integration: Process Flow Principles and Module Dependencies
Role in the Complete Flow In a 7nm FinFET technology platform, the mid-level interconnect stack — typically spanning metal levels M4 through M8 — serves as the
28nm Planar Upper-Metal Interconnect Integration: Process Flow Principles and Integration Logic
Role in the Complete Flow The 28nm Planar upper-metal interconnect integration represents a critical transition zone in the back-end-of-line (BEOL) process stac
14nm FinFET Contact Metal Recess Integration: Process Flow, Mechanisms, and Failure Modes
Role in the Complete Flow The 14nm FinFET contact metal recess (CONTACT_MR) module occupies a critical position in the middle-end-of-line (MEOL) sequence, bridg
40nm BSI CMOS Image Sensor Metal-One Interconnect Integration: Process Flow Principles and Integration Logic
Role in the Complete Flow In the 40nm backside-illuminated (BSI) complementary metal-oxide-semiconductor (CMOS) image sensor process flow, the metal-one (MET1)
28nm Planar Middle-of-Line Integration: Process Flow Principles and Strain Engineering Mechanisms
Role in the Complete Flow The middle-of-line (MOL) module in a 28nm planar logic flow sits at a critical juncture between front-end-of-line (FEOL) transistor fo
14nm FinFET Gate Contact Integration: Process Flow, Physics, and Module Dependencies Explained
Role in the Complete Flow In the 14nm FinFET process flow, the gate contact (CONTACT_CG) module occupies a critical bridge between front-end-of-line (FEOL) devi
40nm BSI CMOS Image Sensor Contact Formation: Process Flow, Mechanisms, and Integration Logic
Role in the Complete Flow In the 40nm BSI CMOS Image Sensor process flow, the contact formation module serves as the critical bridge between front-end-of-line (
28nm Planar Copper Bump Integration Process Flow: Principles, Mechanisms, and Integration Logic
Role in the Complete Flow The 28nm Planar copper bump (CB) module occupies a critical junction between back-end-of-line (BEOL) interconnect completion and wafer
14nm FinFET Metal-One Interconnect Integration: Process Flow, Physics, and Module Dependencies
Role in the Complete Flow The metal-one (M1) interconnect module in a 14nm FinFET technology serves as the critical bridge between the transistor-level contact
40nm BSI CMOS Image Sensor Metal-Two Interconnect Integration: Process Flow Principles and Device Physics
Role in the Complete Flow The metal-two (MET2) interconnect module in a 40nm BSI CMOS Image Sensor sits at a critical juncture in the frontside metallization se
7nm FinFET Metal-One Interconnect Integration: Process Flow Principles and ESL Deposition Mechanics
Role in the Complete Flow The metal-one (M1) interconnect module in a 7nm FinFET technology node occupies a pivotal position in the process architecture: it is
28nm Planar Metal-One Interconnect Integration: Process Flow Principles and Integration Logic
Role in the Complete Flow The metal-one (M1) interconnect module in the 28nm planar technology node occupies a pivotal position in the back-end-of-line (BEOL) s