Technical Blog
Deep dive into the physics and integration logic of semiconductor manufacturing
Overlay vs Pattern Edge Error: Which Boundary Moved?
Separate pattern translation, width change and local edge variation to understand overlay and edge-placement error.
Photolithography in Semiconductor Manufacturing: Physics, Chemical Mechanisms, and Process Principles
Photolithography, also referred to as optical lithography or ultraviolet (UV) lithography, is the process by which geometric circuit patterns are transferred from a photomask…
Lithography in Advanced Semiconductor Manufacturing: Physics, Chemical Mechanisms, and Node Evolution
In modern integrated circuit (IC) fabrication, lithography serves as the fundamental cornerstone for pattern generation and transfer.
Pre-Litho Clean: Fundamental Principles, Chemical Mechanisms, and Node Evolution in Advanced Semiconductor Manufacturing
In the realm of ultra-large-scale integration (ULSI), surface cleaning is a continuous and critical necessity.
ArF Immersion Lithography: Physics, Process Principles, and Sub-10nm Scaling
For decades, the semiconductor industry has relentlessly pursued scaling to maintain the performance gains and cost reductions predicted by Moore’s Law.
Photolithography in a 40nm Process Flow
Photolithography exposes and develops a resist image that guides later pattern transfer. The number of lithography steps varies by chip flow.
Extreme Ultraviolet Lithography: Principles, Physics, and the Path to Sub-5nm Semiconductor Manufacturing
What Is Extreme Ultraviolet Lithography and Why Does It Matter? In the relentless pursuit of smaller, faster, and more energy-efficient semiconductor devices, lithography has…