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Explore BEOL interconnect physics — copper dual-damascene, barrier/seed layers, electromigration, and RC delay scaling. Learn how metallization schemes evolve from 28nm through 7nm and beyond.

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copper dual damascene

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Technical Blog

Deep dive into the physics and integration logic of semiconductor manufacturing

InterconnectMar 15, 20265 min read

Copper Dual Damascene: Principles, Process Integration, and Evolution in Advanced BEOL Metallization

1.Introduction Copper dual damascene is a foundational back-end-of-line (BEOL) metallization technique that simultaneously forms a metal via and a metal trench

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