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28nm Process FlowPlanar MOSFET

Mature process node with full coverage from STI to Final Passivation. Ideal for learning semiconductor manufacturing fundamentals and HKMG integration.

28nm Planar Flow

266 steps

Step index

  • Active Area · AA Pad Oxidation
  • Active Area · AA Pad Nitride Deposition
  • Active Area · AA Amorphous Carbon Deposition
  • Active Area · AA N-free DARC Deposition
  • Active Area · AA Cap Oxide Deposition
View full flow →

Node knowledge map

28nm Process Integration Library

Start with the node overview, then open the physics and integration logic for each module. Every article returns to its exact Flow step.

Node overview28nm Planar Process Flow: Integration Logic, Device Physics, and Module Dependencies
  1. 259CB28nm Final Dielectric Passivation and Opening Integration
  2. 01AA28nm Planar Active-Area Definition Process Flow: Integration Principles and Physical Mechanisms
  3. 08STI28nm Planar Shallow Trench Isolation Process Flow: Principles, Integration Logic, and Mechanisms
  4. 26WELL28nm Planar Well Formation Process Flow: Integration Logic, Device Physics, and Module Dependencies

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  • 33GATE28nm Planar Gate Stack Integration Process Flow: Principles, Mechanisms, and Integration Logic
  • 60IMPLANT28nm Planar Well and Channel Implant Integration Process Flow: Principles, Mechanisms, and Integration Logic
  • 93SD28nm Planar Source-Drain Integration Process Flow: Principles, Mechanisms, and Integration Logic
  • 104SPACER28nm Planar Sidewall Spacer Integration Process Flow: Principles, Mechanisms, and Integration Logic
  • 127MOL28nm Planar Middle-of-Line Integration: Process Flow Principles and Strain Engineering Mechanisms
  • 150CONTACT28nm Planar Contact Formation Process Flow: Integration Principles, Mechanisms, and Module Dependencies
  • 155RMG28nm Planar Replacement Metal Gate Integration Process Flow: Principles, Mechanisms, and Integration Logic
  • 168M128nm Planar Metal-One Interconnect Integration: Process Flow Principles and Integration Logic
  • 205M228nm Planar Metal-Two Interconnect Integration: Process Flow Principles and Mechanism Deep Dive
  • 225M3_PLUS28nm Planar Upper-Metal Interconnect Integration: Process Flow Principles and Integration Logic
  • 244RV_APL28nm Planar Redistribution Via and Aluminum Pad Integration: Process Flow Principles and Integration Logic