Technical Blog
Deep dive into the physics and integration logic of semiconductor manufacturing
40nm BSI CMOS Image Sensor Metal-Five Interconnect Integration: Process Flow Principles and Integration Logic
Role in the Complete Flow In a 40nm backside illumination (BSI) complementary metal-oxide-semiconductor (CMOS) image sensor, the metal-five (MET5) interconnect
40nm BSI CMOS Image Sensor ILD6 Integration: Process Flow Principles and Dielectric Physics
Role in the Complete Flow In a 40nm back-side illuminated (BSI) complementary metal-oxide-semiconductor (CMOS) image sensor fabrication sequence, the sixth inte
40nm BSI CMOS Image Sensor Backside Wafer Thinning Process Flow: Integration Principles and Physical Mechanisms
Role in the Complete Flow The 40nm BSI CMOS Image Sensor represents a generation of imaging devices where the photodiode array and the readout circuitry occupy
14nm FinFET Gate Stack Integration Process Flow: Principles, Mechanisms, and Module Dependencies
Role in the Complete Flow The gate stack integration module for the 14nm FinFET generation occupies a pivotal position in the overall process flow for the 14nm
7nm FinFET Starting Wafer and Substrate Preparation: Integration Principles, Device Physics, and Process Flow
Role in the Complete Flow The starting wafer and substrate preparation (WFR) module is the foundational entry point of the entire 7nm FinFET process flow P1. Be
14nm FinFET Contact Trench Integration Process Flow: Physics, Mechanisms, and Module Dependencies
Role in the Complete Flow The 14nm contact trench integration module occupies a critical transitional position in the overall FinFET fabrication sequence, bridg
14nm FinFET Starting Wafer and Substrate Preparation: Integration Logic, Physics, and Module Fundamentals
Role in the Complete Flow The 14nm FinFET starting wafer and substrate preparation module — often referred to as the WFR (wafer start) module — is the very firs
28nm Planar Contact Formation Process Flow: Integration Principles, Mechanisms, and Module Dependencies
Role in the Complete Flow In the 28nm Planar process flow, the contact formation module occupies a pivotal position: it bridges the front-end-of-line (FEOL) tra
7nm FinFET Contact-Via Integration Process Flow: Principles, Mechanisms, and Module Dependencies
Role in the Complete Flow The 7nm FinFET contact-via integration module occupies a pivotal position in the overall process sequence: it bridges the front-end-of
7nm FinFET Replacement Metal Gate Integration Process Flow: Principles, Mechanisms, and Integration Logic
Role in the Complete Flow The replacement metal gate (RMG) module in a 7nm FinFET process flow is the defining structural transformation that converts a tempora
28nm Planar Redistribution Via and Aluminum Pad Integration: Process Flow Principles and Integration Logic
Role in the Complete Flow The 28nm Planar redistribution via and aluminum pad integration module occupies a critical position near the terminal portion of the b
40nm BSI CMOS Image Sensor Via-One Integration: Process Flow Principles and Device Physics
Role in the Complete Flow In the 40nm BSI CMOS Image Sensor process flow, the via-one (V1) integration module serves as the first vertical interconnect bridge b