The electrochemical reaction rate is further influenced by interfacial overpotential and mass transport within the Nernst diffusion layer, linking global current application to local microstructural evolution [P2].
M2 Copper Electrochemical Plating exists to convert the patterned dielectric trenches and vias of the M2 level into a continuous, low-resistance metal interconnect network by completely filling these features with copper following barrier…
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