Pad compliance and deformation behavior further shape pressure distribution and thus local removal uniformity, motivating the use of pad designs that limit long‑range deformation to stabilize planarization across heterogeneous STI layouts [A2].
STI CMP is positioned in the flow after trench fill oxide deposition, post-fill clean, and densification anneal to remove the oxide overburden and re‑establish a globally planar surface while stopping on the s…
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