Active-area etching transfers the mask pattern through the stack into silicon trenches, establishing geometry for later stripping, cleaning and isolation filling (Engineering Practice).
This Flow uses an in-situ hardmask approach for AA Etch. The resist pattern is transferred through the upper transfer layers, organic hardmask, silicon nitride and pad oxide, then into the silicon substrate. Consecutive source illustrations show intermediate states of this processing chain, not repeated indepen…
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