Key process parameters interact in well-understood directions: increasing ion energy or flux enhances etch anisotropy and rate, while increasing the relative contribution of neutral radicals favors chemical selectivity over physical damage [P3].
The Dummy Poly Dry Removal step is positioned in the CONTACT module after ILD0 HARP deposition and prior to Dummy Poly Wet Removal to initiate controlled opening of the sacrificial gate volume while preserving …
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