28nm Planar Flow 28nm Process Step | SemiFlows
28nm Planar Flow
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V1M2 Etch
219
/ 266
Locked step
M2 Copper Electrochemical Plating
219
/
266
Locked step
Next step
Overview
Active Area
7
1
AA Pad Oxidation
2
AA Pad Nitride Deposition
3
AA Amorphous Carbon Deposition
4
AA N-free DARC Deposition
5
AA Cap Oxide Deposition
STI
18
8
AA Etch
15
STI Liner Oxidation
18
STI HARP Oxide Deposition
21
STI CMP
Well
7
Gate
27
45
High-k HfO2 Deposition
54
P1 Poly Photo
Implant
33
Source/Drain
11
100
SiGe Deposition
Spacer
6
107
Spacer2 Etch
Source/Drain
17
MOL
23
Contact
5
RMG
13
155
Dummy Poly Dry Removal
167
MG CMP
Metal 1
8
Contact
12
187
CT Tungsten CMP
Metal 1
17
Metal 2
20
218
V1M2 Etch
222
M2 Copper Electrochemical Plating
224
M2 Cu CMP
+17 steps
Upper Metal
19
Resistor Via
15
CB Passivation
8
262
CB Etch
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