Self-aligned tungsten-contact CMP clears field overfill while retaining in-hole paths before PMD recessing and the resistor module (Engineering Practice).
This step follows the Ti silicide precursor, TiN cap and SC Metal Fill Deposition, and precedes PMD Surface Recess and metal-resistor depositions. CMP preserves connection positions established by prior openings; W fill or CMP does not create self-alignment anew or prove full conversion of a precursor into the target silicide phase.
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