The growth of the pad oxide is achieved via dry thermal oxidation, where the substrate is exposed to oxygen gas at elevated temperatures [P4].
In the 14nm FinFET patterning module, the vertical fins are defined using a multi-layer hardmask stack that undergoes advanced lithography and anisotropic etching [P1][P2]. To initiate this patterning stack, a robust silicon nitride layer (Pad Nitride) is deposited to serve as both an etch mask and a chemical mechanical planarization (CMP) stop layer [P4]…
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