Technical Blog
Deep dive into the physics and integration logic of semiconductor manufacturing
Vertical Interconnect Access (Via): Physical Principles, Integration Logic, and Advanced Node Evolution
A via connects two wiring levels. Follow the actual Via 1 photo and dielectric etch steps, then compare the earlier contact examples without confusing the two.
Understanding Annealing in Semiconductor Manufacturing: Physics, Principles, and Process Evolution
Annealing is a fundamental thermal treatment used to alter the physical, chemical, and electrical properties of semiconductor materials.
Chemical Vapor Deposition: Fundamental Physics, Mechanisms, and Advanced Process Integration
CVD forms films through reactions of gas-phase precursors. The linked 40nm deposition steps establish film locations but do not identify the deposition method as CVD.
DUV: From Exposure to Pattern Transfer
Deep ultraviolet (DUV, excimer lasers) is the workhorse exposure band of lithography: shorter wavelength buys smaller critical dimensions, in a relay of exposure, development, and etch transfer.
Hydrofluoric Acid (HF): Selectivity Limits
HF can remove silicon dioxide faster than silicon in selected oxide cleans. Oxidizers and neighboring films change that selectivity; check the full stack.
Physics and Integration of Inductively Coupled Plasma in Advanced Semiconductor Manufacturing
Inductively coupled plasma (ICP) represents a fundamental technological pillar in modern semiconductor fabrication, enabling precise pattern transfer and material surface…
LPCVD in Process Integration: Film Roles and Thermal History
Explain how a deposited film connects earlier structures to later processing.
Plasma Enhanced Chemical Vapor Deposition (PECVD): Physics, Mechanisms, and Integration in Advanced Manufacturing
Plasma enhanced chemical vapor deposition (PECVD) is a highly versatile thin film deposition technique widely utilized throughout modern semiconductor device manufacturing.
Reactive Ion Etching in Semiconductor Manufacturing: Physics, Principles, and Process Evolution
Reactive ion etching (RIE) is a cornerstone dry etching technology used extensively in semiconductor manufacturing to transfer lithographic patterns into various substrate…
TMAH: The Metal-Free Developer and Si Etchant
Tetramethylammonium hydroxide (TMAH) is a metal-cation-free quaternary base: positive-resist developer, anisotropic silicon etchant, and alkaline engine of post-CMP cleans — a chemical platform built on high pH without metallic contamination.
Wet Clean in Semiconductor Manufacturing: Physics, Mechanisms, and Integration
Wet clean is a foundational process in semiconductor manufacturing, designed to remove particulate, metallic, organic, and native oxide contamination from wafer surfaces.
The Physics, Integration, and Evolution of Work Function in Advanced Semiconductor Manufacturing
In the realm of advanced semiconductor manufacturing, the concept of work function (WF) is a cornerstone of transistor design and performance scaling.