Metal-gate CMP clears excess field metal and controls gate-top topography; sidewalls inherit the gate trench, and gate height is distinct from dielectric thickness (Engineering Practice).
This Flow performs work-function-metal deposition, Metallization Scrub and W Fill Metal Deposition before Metal Gate CMP. CMP removes excess tungsten and the conductive field liners that must be cleared, interrupting conductive paths outside the gate trenches and contr…
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